With just three simple clicks, users can define the specific area on the assembly where residual solder needs to be removed after desoldering a component. The Auto Scavenger module then automatically identifies the required tracks and initiates the cleaning process promptly, while ensuring the board remains preheated.
Featuring cleaning speeds ranging from 1 mm/s to 3 mm/s, the module ensures efficient and thorough removal of residual solder from large electronic assemblies. Moreover, users have the flexibility to fine-tune the cleaning performance by adjusting parameters such as nitrogen temperature and track speed. Individual profiles can be saved for each assembly, enabling a customized and optimized cleaning process.
The module operates with a constant base temperature for the entire assembly. The solder to be removed is heated on the board surface using an N2-fed hot gas nozzle and then extracted via a vacuum nozzle. Importantly, the automatic height control feature ensures that the assembly remains untouched physically throughout the process. Additionally, users can mark ‘keep out areas’ directly in the live image, designating specific regions where suction is not required. Once the solder removal is complete, the assembly is efficiently cooled down and ready for the seamless reinstallation of a component.
“The introduction of the Auto Scavenger Module represents another step forward in rework technology,” said Todd DeZwarte, Director of Sales – North America, Rework & Inspection at Ersa. “We are excited to offer our customers a solution that not only enhances the cleaning performance of the HR 600 XL rework system but also provides the flexibility and precision required for diverse assembly requirements. This module enables efficient and reliable removal of residual solder, contributing to improved productivity and high-quality results.”
The Auto Scavenger Module is now available as an optional feature for the Ersa HR 600 XL rework system, empowering manufacturers to optimize their rework processes.
