Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Top-news/Artikel
    Koh Young’s 3D AOI, SPI solutions in two-day seminar, demos at Technica USA
    Foto: Umberto / Unsplash
    Top-news

    Koh Young’s 3D AOI, SPI solutions in two-day seminar, demos at Technica USA

    Koh Young America recently participated in a two-day technology seminar with other industry-leading equipment suppliers. The event was hosted by Technica
    Veröffentlicht
    15. Juli 2016
    Lesezeit
    1 Minute
    Rubrik
    Top-news

    Following the seminar, Frank Medina, President of Technica USA, stated, “We were very pleased with the turnout for our annual event. As I have mentioned in the past, Technica believes in adding value to our relationships with our customers. Sponsoring our event every year is one of the many ways in which we demonstrate this commitment.” He added, “Our Technology Forum provides us with an opportunity to expose our customers to the latest technologies available in the market. Our ability to deliver knowledge that is interesting and valuable to our customers is possible thanks to the partnerships we have established with industry-leading companies including Koh Young.”

    www.kohyoung.com

    Mehr aus Top-news

    Weitere aktuelle Artikel aus der Rubrik Top-news.

    Alle Top-news-Artikel
    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026Foto: Indium Corporation
    Top-news

    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026

    7. Oktober 2026

    Indium Corporation and SMT Thermal Discoveries will jointly demonstrate how pairing Durafuse LT mixed-powder alloy with the SMT R320 convection reflow oven cuts energy costs and emissions by 25% compared with…

    ITW EAE Electrovert EcoWave Wins 2026 NPI AwardFoto: Bermix Studio / Unsplash
    Top-news

    ITW EAE Electrovert EcoWave Wins 2026 NPI Award

    1. Oktober 2026

    ITW EAE has received a 2026 New Product Introduction Award for the Electrovert EcoWave, an option for its wave soldering machine platform.

    Omron Promotes End-to-End Barcode Reading and Sensing for Production TraceabilityFoto: Edgar Cornejo / Unsplash
    Top-news

    Omron Promotes End-to-End Barcode Reading and Sensing for Production Traceability

    8. September 2026

    Omron Inspection outlines an end-to-end barcode reading and sensing approach designed to provide full visibility across electronics production processes, supporting traceability requirements in smart factory…

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and TraceabilityFoto: Cybord
    Top-news

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and Traceability

    6. September 2026

    Cybord has announced a fully air-gapped version of its Visual AI component analytics platform, enabling organisations operating restricted or closed networks to run advanced inspection and traceability capabilities…

    ← Zurück zu Top-newsZur Startseite