This report covers five main focus areas: higher density, design concerns/signal integrity, change in processing/manufacturing techniques, technical business challenges, and compliance/environmental issues.
Data from the report indicate:
- HDI (high density interconnect) usage/fabrication has increased from 37.5% to just over 49% in five years. In addition, the median has shifted from 35% present day to 50% in five years. This indicates more of the respondents predict even greater usage/specification of HDI boards in five years.
- In terms of PCB design limitations, heat dissipation is a major concern based on the respondents’ answers. The majority of the respondents (71%) indicated thermal vias are the primary method to manage heat dissipation.
- Respondents indicated that there will be continued use of a variety of solderable finishes. The consensus that there is no universal finish (one that meets everyone’s needs) is prevalent.
- Respondents face a wide variety of business challenges: achieving better yields, moving up the technology curve, workforce training and finding competent personnel are key levers needed to drive business.
- Respondents overwhelmingly are losing sleep over workforce development, lack of staff’s basic engineering skills, supply chain lead times and product overregulation.
IPC’s PCB Technology Trends 2023 is available to buy on IPC’s Online Store.
