“The harmful effects of lead on human health and the environment are driving the development of high-temperature lead-free (HTLF) solders to replace high-Pb solders for die-attachment and clip-bond in power device applications,” the company explained
High temperature
“Indium Corporation’s Durafuse HT features a novel design based on a mixed-alloy technology, designed to deliver a tin-rich HTLF paste, presenting the merits of both constituent alloys. The alloy delivers:
- Simplified processing; Durafuse HT is a drop-in replacement for high-Pb solder, with no special equipment needed and minimal process adjustments
- Enhanced thermal cycling reliability; equal or higher than high-Pb solder
- Lower RDS(on) compared to high-Pb solder+
Low temperature
The company’s Durafuse LT is a patented low-temperature alloy system designed to provide high-reliability in low-temperature applications that require a reflow temperature below 210°C. It delivers:
- Improved drop shock performance more than two orders of magnitude better than Bi-containing low-temperature materials
- Drop shock performance equal or better than SAC305 with proper process optimization
- Ideal characteristics for step soldering and low-temperature requirements
