The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association have called for abstracts for the 3rd Pan-European Electronics Design Conference (PEDC).
Under the theme “Advancing Electronics: From Silicon to Systems,” experts from industry, academia, and development are invited to submit practice-oriented contributions. Abstracts for technical presentations can be submitted until June 30. The conference will take place on January 27–28, 2027, in Amsterdam, and will focus on the critical integration between advanced design and next-generation technologies.
Conference focus and topics
Designed to connect the European electronics industry with the scientific community, the conference highlights the latest developments in electronics design from “silicon to systems.” Submissions should provide in-depth insight into current industrial challenges and present viable, real-world solutions. This year’s core topics include:
- Silicon-to-Systems Design: Package-to-PCB co-design (e.g., uHDI, IC-substrates), electro-mechanical optimization, and multi-physics simulations (e.g., SI/PI, thermal, mechanical);
- High-Performance & Power Electronics: HPC and AI data Ccenters, EV power delivery, Battery management and cooling solutions;
- Next-Gen Applications: Sense-Control-Communication for Space, Defence, and Autonomous Vehicles, High-speed digital and RF/microwave design;
- Design for Excellence (DfX): Circularity, Compliance, Carbon Footprint, Manufacturability, and Reliability;
- Design Software & Tools: Novelties in EDA software, AI implementation in design, Digital Twin, and data handshakes between design and production;
- Sustainability & Lifecycle: Eco-friendly materials, cross-industry data management, and end-of-life/obsolescence management;
- Process Orchestration: Design verification, testing of PCB assemblies, and development workflow management; and
- A forum for the expert community.
“Our primary goal is to provide maximum value for our participants,” commented Dieter Mueller, chairman, FED. “We are looking for presentations that offer clear orientation, provide a realistic assessment of technological trends, and deliver content that can be directly applied to daily operations. In Amsterdam, we will bring together international experts to shape the future of electronics at eye level.”
Speakers will present their expertise to a high-profile audience of electronic designers, manufacturing specialists, process managers, and decision-makers from management, procurement and academia. Speakers benefit from high visibility through extensive media coverage before, during, and after the conference.
“PEDC is built by the design community, for the design community. We are looking for abstracts that push the boundaries of electronics design, particularly in emerging fields like silicon-to-systems, AI in electronics development, design for excellence and sustainability,” said Dr Peter Tranitz, Senior Director, Technology Solutions, Global Electronics Association. “Join us in fostering a truly pan-European exchange that supports the growth of Europe’s electronics ecosystem.”
