Henkel Technologies’ Loctite Chipbonder 3627 is a SMT adhesive formulated for high-speed stencil printing, high speed dispensing and/or jet dispensing applications. Now only a single glue needs to be qualified for all assembly applications. The material can be dispensed at rates of up to 40,000 dots per hour and offers longer on-machine life, as it does not require a higher nozzle temperature. The controlled rheology reportedly provides excellent high-speed stencil printing (up to 150mm/s) and is ideal for use with fine-pitch components. It does not require higher than normal print temperatures and is highly stable at room temperature due to the particularly low moisture uptake. The open time is >24hrs,ensuring a wide process window. This fast-cure adhesive (90 to 120s at 120°C) offers excellent adhesion to a wide variety of substrates. The glass-transition temperature (Tg) is 105°C.
EPP EUROPE 430
