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    Startseite/Hersteller/Henkel Technologies

    Henkel Technologies

    Alle Meldungen, Produkte und Entwicklungen rund um Henkel Technologies.

    2 Meldungen

    Glue for printing, dispensing and jetting
    Applications

    Glue for printing, dispensing and jetting

    14. April 2004

    Henkel Technologies' Loctite Chipbonder 3627 is a SMT adhesive formulated for high-speed stencil printing, high speed dispensing and/or jet dispensing

    Wide process-window lead-free solder paste
    Applications

    Wide process-window lead-free solder paste

    20. Februar 2004

    Henkel Technologies’ Multicore LF320 is a lead-free solder paste optimized for reflow in air. It requires a minimum peak-reflow temperature of 229 °C,

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