The new FX-940 ULTRA 3D AOI from Nordson Yestech incorporates cutting-edge 3D technology for the inspection of solder defects, lead defects/lifted leads and co-planarity of chips, BGA’s and other height sensitive devices. The systems’ advanced 3D sensor provides industry leading metrology capabilities and shadow-free imaging at speeds of up to 8X faster than other systems. The M1m AOI offering high-speed microelectronic device inspection with exceptional defect coverage will also be showcased. With 3 micron pixel resolution and telecentric optics, the M1m provides complete inspection.
SMT Hybrid Packaging, booth 7A-329
www.nordsondage.com, www.nordsonmatrix.com, www.nordsonyestech.com
