Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Top-news/Artikel
    Electronic System Design industry saw record EUR 4.29 billion revenue in Q3 2023
    Bildquelle nicht angegeben
    Top-news

    Electronic System Design industry saw record EUR 4.29 billion revenue in Q3 2023

    Electronic System Design (ESD) industry revenue increased 25.2% to USD 4,702.4 million (EUR 4.29 billion) in the third quarter of 2023 from USD 3,756.3
    Veröffentlicht
    08. Januar 2024
    Lesezeit
    1 Minute
    Rubrik
    Top-news

    “Electronic design automation (EDA) reported record revenue growth in Q3 23,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “This was the highest overall growth since Q4 1998. The Computer-Aided Engineering, IC Physical Design and Verification, Printed Circuit Board and Multi-Chip Module, and Semiconductor Intellectual Property categories reported double-digit growth. Further, all geographic regions reported substantial growth.”

    The companies tracked in the EDMD report employed 59,737 people globally in Q3 2023, a 10.6% jump over the Q3 2022 headcount of 53,034 and up 1% compared to Q2 2023.

    The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

    Revenue by Product and Application Category – Year-Over-Year Change

    • Computer-Aided Engineering (CAE) revenue increased 22.4% to $1,657.5 million. The four-quarter CAE moving average increased 16.7%.
    • IC Physical Design and Verification revenue surged 45.3% to $904.5 million. The four-quarter moving average for the category increased 29%.
    • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 23.6% to $426.1 million. The four-quarter moving average for PCB and MCM rose 14%.
    • Semiconductor Intellectual Property (SIP) revenue increased 22.1% to $1,575.9 million. The four-quarter SIP moving average rose 5.3%.
    • Services revenue slipped 3.9% to $138.3 million. The four-quarter Services moving average rose 6%.

    Revenue by Region – Year-Over-Year Change

    • The Americas, the largest reporting region by revenue, procured $1,984.1 million of electronic system design products and services in Q3 2023, a 22.8% jump. The four-quarter moving average for the Americas rose 11.2%.
    • Europe, Middle East, and Africa (EMEA) procured $551.1 million of electronic system design products and services in Q3 2023, a 21.5% increase. The four-quarter moving average for EMEA grew 13.4%.
    • Japan’s procurement of electronic system design products and services increased 30.5% to $309.3 million. The four-quarter moving average for Japan increased 9.4%.
    • Asia Pacific (APAC) procured $1,858 million of electronic system design products and services in Q3 2023, a 28.1% increase. The four-quarter moving average for APAC grew 17.8%.

    About the EDMD Report

    The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

    • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
    • Revenue by geographic region (Americas, EMEA, Japan and APAC)
    • Total employment at participating companies

    Mehr aus Top-news

    Weitere aktuelle Artikel aus der Rubrik Top-news.

    Alle Top-news-Artikel
    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026Foto: Indium Corporation
    Top-news

    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026

    7. Oktober 2026

    Indium Corporation and SMT Thermal Discoveries will jointly demonstrate how pairing Durafuse LT mixed-powder alloy with the SMT R320 convection reflow oven cuts energy costs and emissions by 25% compared with…

    ITW EAE Electrovert EcoWave Wins 2026 NPI AwardFoto: Bermix Studio / Unsplash
    Top-news

    ITW EAE Electrovert EcoWave Wins 2026 NPI Award

    1. Oktober 2026

    ITW EAE has received a 2026 New Product Introduction Award for the Electrovert EcoWave, an option for its wave soldering machine platform.

    Omron Promotes End-to-End Barcode Reading and Sensing for Production TraceabilityFoto: Edgar Cornejo / Unsplash
    Top-news

    Omron Promotes End-to-End Barcode Reading and Sensing for Production Traceability

    8. September 2026

    Omron Inspection outlines an end-to-end barcode reading and sensing approach designed to provide full visibility across electronics production processes, supporting traceability requirements in smart factory…

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and TraceabilityFoto: Cybord
    Top-news

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and Traceability

    6. September 2026

    Cybord has announced a fully air-gapped version of its Visual AI component analytics platform, enabling organisations operating restricted or closed networks to run advanced inspection and traceability capabilities…

    ← Zurück zu Top-newsZur Startseite