“Thermal interface materials for telecom and network equipment and other advanced devices need to dissipate significant amounts of heat in 5G network and cloud computing systems,” said Samuel Liu, Marketing Manager and Segment Leader. “At the same time, manufacturers need new material solutions that enable reduced labor costs and more efficient assembly. Our new Dowsil TC-4040 dispensable thermal pad is an innovative addition to Dow’s strong and growing portfolio of thermally conductive materials. Its launch underscores Dow’s ongoing commitment to its customers to develop cutting-edge materials that provide a precise balance of properties for outstanding thermal and mechanical performance.”
The company’s dispensable thermal pad supports automated dispensing, stencil printing and screen printing. Piston pump and plunger metering is recommended for dispensing because of the material’s high filler loading. Dowsil TC-4040 dispensable thermal pad offers a superior extrusion rate and delivers precise component coverage with needle dispensing. This high thermally conductive material (4.0 W/mk) has a working time of two to four hours.
The Dowsil TC-4040 is a reworkable gap filler that is supplied as a two-part liquid component kit and has a shelf life of up to six months at room temperature due to its dependable material properties and ease-of-storage. It has excellent reliability of thermal management performance that can resist various harsh environmental testing (e.g. 1000-hour aging test at 150 °C, 1000 cycles thermal shock from –45 °C to 125 °C and 1000-hour 85/85 % RH (high-temperature/high-humidity) aging test).
DOW
2211 H. H. Dow Way
Midland, Michigan 48674 USA
Tel.: +1 (989) 636–1000
Website: www.dow.com
Techcon‘s jet valve dispenses up to 1500 dots per second
