
Dow launched thermal gel for 5G technology
20. Juli 2020Dow introduced the Dowsil TC-3065, a thermally conductive gel developed to dissipate high amounts of heat away from sensitive electronic components.
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Dow introduced the Dowsil TC-3065, a thermally conductive gel developed to dissipate high amounts of heat away from sensitive electronic components.

Dow introduced the Dowsil TC-4040 dispensable thermal pad, a thermal interface material (TIM) that provides strong thermal conductivity.

Dow's electrically conductive adhesive is engineered for reliable performance and electromagnetic compatibility in demanding electrical applications.
Dow unveiled DOWSIL EI-2888 primerless silicone encapsulant, an optically-clear silicone for professional LED lighting that cures at room temperature.

The first web site designed exclusively for epoxy, resins and related products is offering high volume epoxy resins and related products from Dow