Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Top-news/Artikel
    Delivery of 500th test system for high volume production
    Bildquelle nicht angegeben
    Top-news

    Delivery of 500th test system for high volume production

    Xcerra announced that it has shipped the 500th Diamondx test system, reaching a critical milestone for their system-on-a-chip (SOC) test system. It was
    Veröffentlicht
    29. Juli 2018
    Lesezeit
    1 Minute
    Rubrik
    Top-news

    The capabilities incorporates the latest technology for delivering the lowest cost of test while offering instrumentation that can support a wide range of performance requirements, including precision analog, high speed Serdes digital and mmWave RF. The architecture of the system has unique capabilities, such as an Integrated Multi-System Architecture, or IMA, that allows customers to better match the test requirements of a device with the cost profile of the test system.

    Ganesh Moorthy, President and Chief Operating Officer at Microchip, commented,”Diamondx is not only used for testing microcontrollers, we also rely on the system for high volume manufacturing test of our wireless, networking (USB, Ethernet, MOST, etc.), touch controller and other mixed-signal products. Xcerra provides outstanding technical support in all phases of test development and high volume production test, and when combined with the economics delivered, this creates a powerful combination.“

    David Tacelli, President and Chief Executive Officer for Xcerra, commented, “Our goal is to develop the semiconductor test solutions that deliver a powerful combination of performance and economic value complemented by world-class customer support. The growing adoption of the Diamondx by top tier semiconductor suppliers is validation that our strategy is succeeding.”

    www.xcerra.com; www.microchip.com

    Mehr aus Top-news

    Weitere aktuelle Artikel aus der Rubrik Top-news.

    Alle Top-news-Artikel
    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026Foto: Indium Corporation
    Top-news

    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026

    7. Oktober 2026

    Indium Corporation and SMT Thermal Discoveries will jointly demonstrate how pairing Durafuse LT mixed-powder alloy with the SMT R320 convection reflow oven cuts energy costs and emissions by 25% compared with…

    ITW EAE Electrovert EcoWave Wins 2026 NPI AwardFoto: Bermix Studio / Unsplash
    Top-news

    ITW EAE Electrovert EcoWave Wins 2026 NPI Award

    1. Oktober 2026

    ITW EAE has received a 2026 New Product Introduction Award for the Electrovert EcoWave, an option for its wave soldering machine platform.

    Omron Promotes End-to-End Barcode Reading and Sensing for Production TraceabilityFoto: Edgar Cornejo / Unsplash
    Top-news

    Omron Promotes End-to-End Barcode Reading and Sensing for Production Traceability

    8. September 2026

    Omron Inspection outlines an end-to-end barcode reading and sensing approach designed to provide full visibility across electronics production processes, supporting traceability requirements in smart factory…

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and TraceabilityFoto: Cybord
    Top-news

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and Traceability

    6. September 2026

    Cybord has announced a fully air-gapped version of its Visual AI component analytics platform, enabling organisations operating restricted or closed networks to run advanced inspection and traceability capabilities…

    ← Zurück zu Top-newsZur Startseite