At SMT Hybrid Packaging, Zestron will be exhibiting a selection of cleaning machines from international manufacturers that will showcase a variety of innovative and proven technologies to trade show visitors looking for a new cleaning machine. The company’s process engineers and technologists of the equipment manufacturers are available to answer questions about the technology, as well as, the cleaning chemistry optimally adapted to it.
This year‘s offer will be extended by the topics validating and monitoring of cleaning processes to ensure the reliability of the assemblies so that visitors can inform themselves about innovative, non-destructive testing and new measurement concepts.
Another trade show highlight is the area of power electronics, including cleaning agents of the Vigon PE series, which are especially adapted to the requirements of power modules, and the water-based stencil cleaning agent Vigon TC 150 for the removal of thermally conductive compounds.
SMT Hybrid Packaging, Booth 4–329