Semiconductor-packaging
UTAC Announces New High Output Copper Clip DFN
10. Juni 2022UTAC Holdings Ltd. (UTAC), a global semiconductor test and assembly services provider, is announcing a punch copper (Cu) clip packaging solution for power
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UTAC Holdings Ltd. (UTAC), a global semiconductor test and assembly services provider, is announcing a punch copper (Cu) clip packaging solution for power
Singapore-based semi-conductor test and assembly services provider, UTAC, has announced that it has successfully qualified a CMOS image sensor using a 9.0