Company-news
“We do not offer a machine, but a ready-made application”
31. Oktober 2022Tresky manufactures die bonding systems for high mix–low volume production programmes. Managing Director Daniel Schultze explains why the company places
Alle Meldungen, Produkte und Entwicklungen rund um Tresky.
4 Meldungen
Tresky manufactures die bonding systems for high mix–low volume production programmes. Managing Director Daniel Schultze explains why the company places
In the prototyping phase and when producing small series or batch size 1, many companies shy away from investing in their own Die-Bonder. Often, the final
Tresky GmbH will showcase three new options for its die bonders during SMTconnect in Nuremberg, Germany, May 10-12, 2022, in Hall 4A, Booth 234: a new
Tresky's flip-chip option for its T3000 die bonder and component placer units contains a beam splitter that enables a simultaneous view of the substrate