
News
Double capacity increase for electroless Ni/Au and Ni/Pd plating services
26. Mai 2014PacTech GmbH today announced that subsidiary PacTech Asia (Penang, Malaysia) is now doubling capacity for electroless Ni/Au and Ni/Pd wafer level plating
Alle Meldungen, Produkte und Entwicklungen rund um PacTech Asia.
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