Dr. Thorsten Teutsch, President and COO of PacTech USA and COO of PacTech Asia commented, “We are experiencing huge success in MOSFET, RFID, LED, MEMS, and other key product areas with both major IDM’s and fabless customers. Both companies work closely together to insure their mutual success! Over 80% of the volume demand results from our successful qualifications and product transfers from USA to Asia. Additionally, PacTech Asia continues to invest in more automation, inspection and test capabilities, including wafer back metal services growing to 10,000 wafers per month.”
PacTech USA’s Silicon Valley facility located in Santa Clara, CA is not only equipment sales and demonstration centre for the Americas, but also provides rapid support on new designs and early production volume demands. Expedited chip design cycles on first silicon and multi-project wafers are critical to successful design wins with key end customers. Once proven, customers are ready to ramp up production volumes, and rely on their Asia-based external foundry management teams. The “Copy Exact” process transfer from USA to Asia insures the seamless transition handover.
Mr. Heinrich Lüdeke, CEO of PacTech – Packaging Technologies GmbH said, “We continue to commit more investments in 2014–2015, supporting both our advanced equipment manufacturing unit and foundry services operations. Plans include electroplated copper capabilities, embedded die packaging solutions, and next generation high-speed solder jetting machines, as well as laser-assisted bonding equipment. With over 800 production machines in the field and over 115 patents granted, the combination of technologies allows our three locations to provide the widest product offering in the industry; servicing the ASIC, Foundry, Government, Medical, Aerospace, Consumer, Telecommunication, Memory, MEMS, Probe Card, and Hard Disc Drive industries.”
