News
Agreement to enter die bonder market
7. November 2006Kulicke & Soffa Industries has announced the signing of an agreement to acquire Alphasem, a supplier of die bonder equipment, from Dover Technologies
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Kulicke & Soffa Industries has announced the signing of an agreement to acquire Alphasem, a supplier of die bonder equipment, from Dover Technologies
Christian Ossmann has been appointed as European Sales Manager at Alphasem to strengthen its position within the first level packaging market. Within this
The Alphasem Easyline 8033 clip-attach system provides the answer for high-speed, cost-driven applications on power devices. This process replaces the
The Alphasem Easyline 8033 clip-attach system is the answer for high-speed clip-attach applications for power devices such as SOD, SMA, DPAK, TO 220, etc.
Alphasem’s Flexline Polaris multi-process assembly cell bridges the gap between robotics and die-attach equipment in the area of packaging task. The
Semiconductor equipment specialist Alphasem has named Urs Hirsiger as its VP sales & marketing worldwide. Before that, he had worked in various
Alphasem, Swiss-based semiconductor equipment supplier, has promoted Robert Peter to VP business development. Robert has over 10 years of semiconductor
Alphasem of Switzerland, supplier of semiconductor manufacturing equipment and member of the Dover group, has appointed Claus Lichtenberg as president,
The Alphasem EasyLine 8001 performs high-speed die sorting into multiple waffle packs/trays, and features a 30% smaller footprint than comparable
Alphasem, manufacturer of die attach and sort equipment, has appointed Hans Rudolf Meister as president. Gustav A. Wirz, founder of the company, has
Alphasem's Swissline 9020 series for 300mm die attach applications is based on a modular concept that allows epoxy applications on metal lead frames and