Alphasem’s Swissline 9020 series for 300mm die attach applications is based on a modular concept that allows epoxy applications on metal lead frames and organic substrates as well as adhesive tape-based packages (LOC/BOC for memory devices) on the same platform. It features sophisticated wafer handling with a patented adapt-ing system, 5-min-ute changeover to different wafer sizes, and minimal wafer ex-change times during operation (2 wafers are processed in parallel), resulting in a considerable productivity increase. Additionally, a vision engine is integrated into the graphical user interface. This results in high placement accuracy even in large-area matrix applications, and further complements ergonomics due to convenient front access for loading material, changing consumables and executing setup activities. The floor space requirement did not increase compared to the existing 200mm system. This makes it 15% smaller than any other comparable 300mm die bonder.
