
Test probes for bead probe technology
12. Dezember 2008In the case of the Agilent bead probe technology, small solder beads are applied directly to the conductors or the vias of the PC-Board. For contacting
Alle Meldungen, Produkte und Entwicklungen rund um Agilent.
14 Meldungen

In the case of the Agilent bead probe technology, small solder beads are applied directly to the conductors or the vias of the PC-Board. For contacting

Developed to tackle today's complex and shrinking printed-circuit-board assemblies, the Agilent Medalist sj5000 can inspect even the smallest 01005

The Advanced Development Group of Speedline, in cooperation with Agilent, concluded a design of experiment (DOE) to understand and quantify variables in

ScanWorks, a JTAG test system (boundary scan) from Asset (a Texas Instruments’ spin-off) has been integrated seamlessly into Agilent’s in-circuit test

The Agilent Medalist i5000 in-circuit tester (ICT) reportedly delivers the fastest time-to-money ratio for circuit board assemblers through software and

Agilent’s Open test-systems strategy is focused on easing system integration through standard hardware, software and connectivity solutions. It can take

The Agilent Bist Assist 6.4 for the semiconductor industry is a production-test solution that enables signal integrity testing of high-speed serial links

The Agilent Fault Detective/Test Analyzer software enables users to optimize their functional test suites and boosts automated diagnostics accuracy to

Agilent has appointed FEASA Enterprises as its sales and support partner for the electronic manufacturing process test and inspection portfolio in the

In the first quarter of its current business year, the HP spin-off Agilent achieved a minus of $369m, as CEO Ned Barnholt told. Sales was $1.4bn, almost

Agilent has appointed PB Technik as sales and support agent for board assembly test equipment (its so-called Intelligent Test Portfolio). The Hanau-based

Agilent Fault Detective is software that automates functional test diagnostics of board assemblies and sub-systems. It can help cut the cost and enhance

The Agilent 5DX series 5000 is the next-generation, automated 3D X-ray inspection system built on laminography technology. It provides BGA opens detection

The Agilent 5DX series 3 breaks ground in X-ray throughput; this is the result of a benchmark having taken place with different GSM phone boards. Faster