By revising the layout in the machine and further optimizing the motion control of the X-Y axis, the mounter achieves productivity of 120,000 CPH. In addition, thanks to improved rigidity of the newly developed conveyor and the mount position compensation function, it can attain high-accuracy mounting of +/-15µm (Cpk=1.0).
In dual lane production mode, the maximum board width is 12.9” (330 mm) when boards of the same width are conveyed in two lanes. In single-lane production mode, where only one of the two lanes is used, the system can transfer boards up to 31.8”
(810 mm) in length, 24.0” (610 mm) in width, 6.6lbs (3 kg) in transportable weight, and 0.25” (6.5 mm) in maximum board thickness.
The laser unit‘s board height measurement and low static load nozzle reduce stress on tiny components during mounting.
“The new YRM20DL brings dual lane performance to the already high-efficiency, high speed performance introduced this past year in the flagship multi-head YRM20 mounter,” said George Babka, Sales General Manager at the company. The “Overdrive” motion allows placements on the same board at the same time by minimizing the interference range between 2 heads to achieve the highest speed level in its class.
The system also has an odd-shaped components-capable in-line FM head, an ultra-wide range head capable of handling components ranging from tiny 03015mm chips to tall components to 30mm and ultra-large components of 55 x 100mm.
