The RM head can handle components ranging from a tiny 0201mm up to medium-sized odd-shaped components of 12 x 12mm with a height of 6.5mm. The HM head can handle these components as well as larger ones up to 55mm x 100mm x 15mm tall.
“Equipped with two gantries and two multi nozzle placement heads, the YRM20 is 10% to 20% faster than our previous model,” the company said. This was achieved by reducing the weight of the head, improving motion control as well as employing “Overdrive” motion that allows placements on the same board at the same time by minimizing the interference range between 2 heads.
In addition to a high-speed multi-purpose in-line HM head, the system offers new features including an odd-shaped components-capable in-line FM head and an ultra-wide range head capable of handling components ranging from tiny 03015mm chips through tall components of 30mm to ultra-large components of 55 x 100mm. Force control is also available. The mounter’s popular dual-stage conveyor now also has enhanced PCB handling capability. The company said the high-speed PCB conveying dramatically cuts the time needed for PCB changeovers.
