The 2200 evo is not just intended for die attach, but is also a fully-fledged flip-chip bonder. Further features include the heatable bonding tool, e.g. for stacked-die applications, and the broad handling range from 250 µm small up to 50 mm large dies. This enables production, for instance of SiPs (System in a Package), with all kinds of active and passive components in a single pass. This increases not only the throughput but also the yield. The tried-and-tested modular concept has also been retained in the 2200 evo. For high production volumes, several multi chip die bonders can be linked up to work in parallel.
EPP EUROPE 434
