According to Dr Farassat, the recipe for success is mainly the intelligent platform strategy exploiting many proven components such as drives, controls and bond-heads which are already used in the prize-winning basic G5 wire bonder in many hundred installations. Reliability and bond quality are, so to speak, family traits shared by the new members of the wire bonder family.
Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This
Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and