- Wire bond inspection and die wire metrology
- Die placement metrology
- Epoxy spread and bridging
- Lead frame integrity
- 2D and 3D high-resolution imaging
- Ball diameter, shape, offsets and damage;
- Coplanarity and height measurements
- Die alignment metrology on the substrate
- Edge, FM and surface
- Flux and paste
- Die metrology
- Die surface and edge chips
- Traceability products and image archiving





