As the last process step in forming electrical and mechanical connections, the ball-attach process has an important impact on the overall product yield and cycle time. The industry’s most popular ball-attach technology involves using paste flux and a solder sphere. The company offers industry-leading fluxing technology to ensure effective assembly.
SMF-WC53 flux is a halogen-free, water-soluble flux designed for use in ball-attach processes. This flux is also ideal for printing and transferring applications as it offers excellent solderability on all substrate surface finishes. Additionally, the company’s high reliability series solder sphere has exceptional thermal and impact reliability, offering exceptional performance.
