The IX-4000 ChromAblate is an excimer laser version for LED liftoff, via drilling, micro-machining, thin film patterning and other semiconductor packaging applications. Whether micro-machining features to 2 µm or configured for large area exposure of up to 5 mm x 5 mm, the excimer laser version is engineered for 24/7 industrial production with a high degree of flexibility and configurability. The system features dual cassette loading ports, production-grade robotics, wafer pre-aligners and vision, all combined in a user-friendly class I laser system. Applications include laser lift-off, selective wafer annealing, micro-drilling, dicing and scribing, ink jets, via drilling, blind holes, micro-fluidics, thin film patterning, selective material ablation, MEMS, 3-D micro-machining, fire-on-the-fly operation and more.
Features include full automation, including part load/unload robotics, pre-aligners and vision system for unattended production. A variety of standard and custom end effectors are available for any part-handling requirement; compact design; modular configuration; plus high accuracy, with linear motor air bearing stages providing accuracies to less than 2 μm. The excimer laser version also offers a large workspace, as it can be configured with stages able to handle wafers up to 300 mm. Additionally, it provides a uniform beam profile, with a variety of imaging and non-imaging homogenizers available for large-area applications.
EPP Europe 438
