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    Startseite/Applications/Artikel
    Wafer bumping and ball placement deliver increased throughput
    Foto: Mariana B. / Unsplash
    Applications

    Wafer bumping and ball placement deliver increased throughput

    By utilizing stencil-printing and enclosed print-head material deposition, DEK has implemented cost-effective and yield-enhancing bumping and
    Veröffentlicht
    07. Oktober 2005
    Lesezeit
    1 Minute
    Rubrik
    Applications

    www.dek.com

    EPP EUROPE 440

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    Under the motto “Assembling the Future”, Phonotronica Ltd. has been a pioneer in the development and manufacture of electronic modules since 1990.

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