Many of today’s leading semiconductor manufacturers experience issues with thin compound semi die (250μm) migrating out of the pockets of waffle pack trays during shipping.
Working with BAE Systems, Gel-Pak has engineered a patent-pending Lid-Clip Super System (LCS2) compatible with standard waffle pack trays. The system was designed to ensure effective sealing of every pocket and to establish a solution for the costly ‘component out of pocket’ (COOP) issue during semiconductor IC transport/handling. BAE Systems’ engineers have been using a customized solution from VJ Electronix designed for x-ray waffle pack inspection on its XQuik II X-ray Component Counter to facilitate the development of the new waffle pack.
“This collaboration with VJ Electronix offers the potential to save semiconductor manufacturers millions of dollars,” said Rich Rochford, a senior principal engineer at BAE Systems. “This die migration issue results in costly returned merchandise, yield loss and rework labor.”
In 2019, the company’s XQuik II evolved from an automated tape & reel component counting machine to become the industry’s first fully automated component counter for components in up to ( 20)2.0” waffle packs. It was used to test the LCS2 performance which was validated by rigorous 34” & 84” drop testing of 50μm GaN die loaded in industry standard waffle trays. VJ Electronix’s X-ray imaging confirmed the absence of Components Out Of Pocket (COOP) conditions when using the LCS2. In comparison, when performing same drop tests using industry standard waffle pack solution, COOP was readily observed, the company explained.
