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    VHR sensor module for inspection of wire bonds under 17 µm diameter
    Foto: Johannes Plenio / Unsplash
    Applications

    VHR sensor module for inspection of wire bonds under 17 µm diameter

    Wire bonding is one of the most demanding connection techniques in the electronics industry. It includes thick-wire bonding with diameters larger than 500
    Veröffentlicht
    19. September 2007
    Lesezeit
    1 Minute
    Rubrik
    Applications

    The VHR sensor technology accomplishes the reliable inspection of bond wires with extremely small diameters. This development is a consequence of the familiar company tradition, of integrating illumination control and high-quality optics. The VHR sensor module is able to record images of the inspection object with different illumination settings and various diffusions and to find defects with the company’s image processing systems, reliably. In the process, the inspection scope includes the course of the wire, distance between adjacent wires, as well as the positions and geometries of balls and wedges. Thus, the VHR module extends the application area of the typical wire bond inspection systems S6053BO-II and S6056BO.

    www.viscom.com

    EPP Europe 445

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