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    Very fast solder-paste inspection
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    Applications

    Very fast solder-paste inspection

    Orbotech's Symbion P36 automated optical inspection (AOI) solder-paste system features simultaneous 2D and 3D volumetric and area measurements at ultra
    Veröffentlicht
    14. April 2004
    Lesezeit
    1 Minute
    Rubrik
    Applications

    Orbotech’s Symbion P36 automated optical inspection (AOI) solder-paste system features simultaneous 2D and 3D volumetric and area measurements at ultra high-speed without compromising accuracy. It delivers 100% inspection coverage of all paste deposits on the board with precision and tempo. Reportedly, it is a solution that overcomes the limitations of other paste inspection systems that have to compromise on either speed or resolution. By using Symbion as part of an inspection strategy, manufacturers can count on reducing their costs while ensuring throughput. Symbion is said to be up to 3 times faster than current solutions at similar resolutions. The system features point & click simplicity with a user-friendly graphic wizard interface that dramatically reduces set-up time and operator requirements. The machine is fitting into high-volume or high-mix lines. It easily handles all board complexities and solder-paste materials including lead-free. Symbion is a measurement instrument with accuracy to less than 10% Gage R&R and valuable information to help manufacturers close the loop on quality.

    EPP EUROPE 453

    www.orbotech.com

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