“Whether formed once to allow installation during product assembly or flexing dynamically with moving parts such as printer heads or optical drives, the material formula withstands reflow temperatures and maintains its structural integrity to prevent fatigue or corrosion.”
“With high Tg (175°C), high Td (360°C), and a low Dk of 3.8, the material delivers class-leading thermal performance and ease of manufacturing, allowing for better board design for applications requiring critical thermal management in the harshest environments. Customers can choose between glass fabric options of 1067, 1078, and 1080 with pressed thicknesses from 2.2 to 3.3 mil/ply (0.056 to 0.084 mm/ply). It is also lead-free assembly compatible, fulfills RoHS and WEEE requirements, and complies with UL94 V-0.”
In line with the company’s strict manufacturing and supply processes, the new material is manufactured using strict quality-controlled processes that are of course accredited with AS9100 and IATF quality standards, and conversant with applicable IPC, space agency and MIL-STD specifications. It is manufactured at the group’s state-of-the-art facilities in China and Taiwan that feature treaters equipped with its proprietary multiple-stage filtration systems on the front end and 100% AOI for prepreg FOD-control on the back end. They ensure the manufacturer’s global supply capacity for the full range of no flow / low flow prepregs for flex-rigid applications.
