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    Vapor phase-reflow-soldering with active profile control
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    Products

    Vapor phase-reflow-soldering with active profile control

    Asscon Systemtechnik-Elektronik GmbH presented an absolutely innovative novelty, the „Dynamic Profiling Plus“, a further development of the patented
    Veröffentlicht
    27. Mai 2015
    Lesezeit
    2 Minuten
    Rubrik
    Products

    A salute to Industry 4.0.

    For the vapor phase soldering process, the solution provides an important component to minimize the production preparation, while the internal measuring system for creating and monitoring the soldering profiles configures itself and optimizes the measured temperature behavior of the assembly. It is self-evident that the data recorded via „Dynamic Profiling Plus“ can be saved in databases for backup and traceability. The solution is therefore an important step for the vapor phase process up to Industry 4.0.

    www.asscon.de

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