The system features process temperature up to 450 °C, heating ramp up to 50 K/min, cooling rate up to 180 K/min and a vacuum level up to 10-2 mbar. It has a short cycle time. The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface lets users transfer data to PCs for offline programming and remote service monitoring. The soldering system is optionally available with lamp heating (radiation) for increased heating-up. Typical applications of the vacuum soldering equipment are: power semiconductors, optoelectronic packaging, hybrid microelectronic assemblies, hermetic package sealing, wafer level packaging, MEMS package sealing and UHB LED packaging.
EPP Europe 418
