Ultrasonic gold-to-gold flip-chip bonder reduces weight and size of the package

The bonder uses the gold-to-gold ultrasonic-interconnecting method, allowing for considerable reduction in weight and size of the package. The AFM-15 also supports lead-free manufacturing. This machine addresses the industry demand for further miniaturization and better electric features for products, such as short ways for signals and better transfers of frequencies, alongside with enhanced temperature resistance.

www.tdk-components.de

EPP EUROPE 438