Alpha Assembly Solutions, a producer of electronic soldering and bonding materials, is introducing SAC305 ultrafine cored wire for use in attaching or repairing very fine pitch components approaching 0.20 mm.
“With the increase of solder joint density and miniaturization, the ultra-fine cored wire is an ideal solution where solder paste reflow or other soldering applications are not compatible to the design”, said Bernice Chung, Global Portfolio Manager for Wave Soldering. “Fine pitch PCB assemblies have higher quality and reliability standards, which requires precise solder wire feeding volume and non-skip solder feeding. Ultra-fine cored wire delivers consistent diameter size and flux continuity to ensure unfailing wire feeding, especially in robotic soldering, such as laser soldering technologies”.
It offers fast soldering performance and has passed the most stringent reliability tests. It can be used for any customer who has previously approved larger diameter wire using the company’s Telecore HF-850, XL-825 or Plus core fluxes. Provided in cored wire for convenient use, the ultra-fine cored wire is available in 0.2 mm, 0.15 mm and 0.1 mm to fit different process requirements.
