Akrometrix, LLC, a provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, will display its newest warpage metrology system at productronica 2017, scheduled to take place Nov. 14 – 17, 2017 at the Messe München, in Germany. The new Tabletop Shadow Moiré (TTSM) system offers all of the software features of the company’s thermal warpage metrology systems in a room temperature unit which provides full field-of-view measurement in less than two seconds.
The company is not only able to provide thermal warpage, but also has optional modules for both DIC strain/CTE measurements and DFP for discontinuous surfaces. Utilizing a novel combination of both top and bottom heaters with shadow moiré, they are providing temperature uniformity previously unattainable in the industry on a flexible/configurable platform.
The TTSM responds to the industry’s demand for an ultra-fast tabletop warpage metrology system. It enables customers to measure warpage of substrates up to 300 mm x 310 mm (a 300 mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, it provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
productronica, Booth A3.102/1