A single TPR places ICs at up to 16,000 cph and can assemble all the major types including naked dies, flip chips, stacked chips, PiP (Package-in-Package) and SIP (System in Package) devices. With the other A-Series robots placing up to 94,000 cph, the TPR helps match chip and IC placement rates to significantly reduce the overall cost of placement. Placing chips and ICs with the same machine saves labor, energy, maintenance and other operational costs of a separate line balancing machine. The A-Series suits high volume and high mix production, with fast New Product Introductions and batch sizes right down to one. The machines can pick ICs from a range of carriers including Jedec tray stackers and tape on reel.
The A-Series now has an accuracy of 25 microns and repeatability of 17 microns, essential for reliable assembly of micro-miniature chip components and fine-pitch devices. Adding multiple TPRs and reducing the individual robot speeds to increase the settling time will soon also improve placement accuracy enough for A-Series machines to be used for encapsulating semiconductors at a much higher rate than is now possible.
