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    Total process solution for substrate centering and transport
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    Applications

    Total process solution for substrate centering and transport

    Building on the technology of its Virtual Panel Tooling (VPT) high throughput substrate imaging system, DEK has advanced this concept further and
    Veröffentlicht
    19. September 2007
    Lesezeit
    2 Minuten
    Rubrik
    Applications

    Through a design that consists of a base carrier with a low-maintenance consumable foil, the carrier provides the stability, centering and alignment capabilities required to process multiple substrates or components in a single panel, improving throughput. Parts are placed in the carrier either manually or loaded with a placement system. Substrates are held in the carrier via a patented 4-sided tensioning mechanism and then aligned within the carrier using an innovative centering system. Parts are referenced using two global fiducials – as opposed to individual component fiducials – thus enabling the easy transfer of VPC throughout all assembly processes. The system is also scalable, allowing manufacturers to adjust component quantity for individual processing requirements.

    www.dek.com

    EPP Europe 429

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