Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Technology/Artikel
    Total line solution with surface-mount assembly
    Bildquelle nicht angegeben
    Technology

    Total line solution with surface-mount assembly

    Yamaha Motor Europe IM Division will showcase its total line solution, delivering the latest in high-accuracy, high-speed, high-quality & flexible
    Veröffentlicht
    04. September 2017
    Lesezeit
    3 Minuten
    Rubrik
    Technology

    The new booth layout is designed to welcome and inform, enabling visitors to overview the total product portfolio and focus on individual display areas to gain deeper insights into equipment and software of special interest.

    Auto loading feeder

    The biggest improvement in line productivity & efficiency is the introduction of the Auto Loading Feeder (ZS-ALF). This feeder allows the addition of a second reel to supply in the same feeder at any time during operation. It’s design removes any need for splicing materials or operators with good splicing skills, while reducing tape waste and paper dust particles. It also reduces machine down time, increases line efficiency, and boosts placement quality.

    3D MID production platform

    The SMT industry is at the beginning of a new era containing advanced and innovative products built with 3D printing materials and printed electronics. For this type of production, the company will introduce the S20–3D MID (Molded Interconnect Device) machine. Built on a standard S20 mounter paltform, it is able to dispense adhesive or solder and mount components on 3D substrates at any angle.

    The YCP10 screen printer features the 3S head with variable-angle squeegee and easy-to-use graphical stencil alignment. The 4-beam YSM40R with a placement speed of 200,000 cph will show how its 1-meter line length delivers a performance edge for space-constrained enterprises.

    Visitors looking for maximum speed with flexibility will find their target in the updated Sigma G5S2, which is improved to reach 90,000 cph high-speed placement. Ultra-configurable thanks to two-head type placement and the integrated Overdrive Control system, it introduces innovations, such as die-feature recognition for optically-accurate LED placement. The YSM20 90,000 cph machine optimizes productivity with features like smart component-shape recognition, automatic accuracy compensation, time-saving 1-head placement, and advanced features for fast changeovers.

    European audiences will also get their first view of the YSM10 mounter, part of the high-speed modular family. The 1-beam, 1-head mounter delivers 46,000 cph placement speed, benefiting from the high-speed multi head, versatile component feeding, multi-camera, e-Vision, and smart component recognition of the YSM40R and YSM20.

    Special focus on latest advances

    The company’s total line solution is completed with the YSi-V high-speed 3D automatic optical inspection (AOI) system. It has a further boost to inspection speed, introduced in 2017, as well as increased resolution for ultra-high accuracy inspecting components down to 0201 (metric).

    The YSi-V family provides versatile choices from entry-level 2D-only to dual-mode 2D/3D inspection, 5Mpixel or 12Mpixel cameras, and the high-speed camera of the HS2 type.

    Checking the boards immediately after placement from four angles and with multiple wavelengths including infrared ensures faultless defect capture with zero errors. Laser height checking also verifies coplanarity and perfect pin-in-paste insertion. In addition, integrated software that converts from mounter data, combined with the intuitive YSi-V graphical user interface (GUI), ensure new product introduction (NPI) achieves the fastest possible ramp-up. It can be used for post-placement, post-reflow, or in both locations – and the closed-loop data interface with mounters enables the unique Quality Assistence (QA) software to send data to the company’s mounters in the line in real-time to resolve any mounting problems quickly.

    The Factory Automation will give a glimpse of how the Advanced Robotics Automation Platform can help boost assembly productivity. The robotics portfolio, like orbit Scara and cartesian robots, are already setting the pace of automation in numerous industries.

    A dedicated software area will help visitors understand the power of the company’s Factory Tools 4.0. This complete suite includes tools for NPI with virtual sticky tape checks, multiple grouping and efficient setup scenarios, monitoring, traceability and planning, and enables real-time status visualization at every level of the factory. In addition, the AOI inspection database, iProDB, captures inspection results from post-mounting & post-reflow to help optimize processes and improve design for manufacture. There are also apps like Mobile Judgement, which keep supervisors informed wherever they are and minimize the time to fix stoppages.

    productronica, Booth A3.323

    www.yamaha-motor-im.eu

    Mehr aus Technology

    Weitere aktuelle Artikel aus der Rubrik Technology.

    Alle Technology-Artikel
    IPC-J-STD-002F mandates automatic flux doctor blade for solderability testingFoto: Louis Reed / Unsplash
    Technology

    IPC-J-STD-002F mandates automatic flux doctor blade for solderability testing

    10. November 2026

    The release of IPC-J-STD-002 Revision F introduces stricter, more precisely defined requirements for solderability testing, including a mandatory automatic flux doctor blade on solderability testers. Equipment lacking…

    Plasmatreat PFW10 and PFW20 Static Plasma Jets Target Sensitive PCB Surface TreatmentFoto: Johannes Plenio / Unsplash
    Technology

    Plasmatreat PFW10 and PFW20 Static Plasma Jets Target Sensitive PCB Surface Treatment

    28. Oktober 2026

    Plasmatreat's PFW10 and PFW20 static plasma jet systems are designed for selective, high-accuracy surface treatment of sensitive electronic assemblies, including circuit boards, using cold atmospheric-pressure plasma.

    Indium Corporation to Present High-Reliability Solder Pastes at EFX 2026 in StuttgartFoto: Indium Corporation
    Technology

    Indium Corporation to Present High-Reliability Solder Pastes at EFX 2026 in Stuttgart

    30. September 2026

    Indium Corporation will exhibit three solder paste technologies at Expo for Electronics Manufacturing (EFX) 2026 in Stuttgart, Germany, addressing thermal cycling performance, low-temperature step soldering and…

    Europlacer: Software as the Core Performance Driver in High-Mix SMTFoto: Brecht Corbeel / Unsplash
    Technology

    Europlacer: Software as the Core Performance Driver in High-Mix SMT

    24. September 2026

    Europlacer makes the case that traditional SMT software was not designed for the demands of high-mix, short-run production, and that the resulting performance gap is increasingly visible on the shop floor.

    ← Zurück zu TechnologyZur Startseite