Nihon Superior Co. Ltd., an advanced joining material supplier, has recently introduced solder pastes that offer solutions to some of the challenges that the electronics industry is now facing, such as improvements in reliability and thermally stable joining. The SN100C is lead-free and reliable due to the eutectic character of the silver-free alloy and the associated high fluidity. This provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.
SN100CV P506 D4 is a no-clean solder paste with a basic composition of Sn-Cu-Ni+Ge+Bi. This new alloy has an addition that enables thermally stable solder joints even after thermal cycling. Unlike silver-containing alloys that derive their strength from a dispersion of fine particles of eutectic Ag3Sn, SN100CV gains its strength from solute atoms in the tin matrix of the joint. The unique ability of this solder paste to survive long-term storage at room temperature allows simplification of stock management while meeting all the requirements of modern reflow soldering processes.
