The new tool will also deliver an effective alternative to a vacuum cup when removing packages such as glob top encapsulated ICs, or certain types of BGAs that display high surface tension when the solder balls are melted during rework. Small components and connectors, particularly those with plastic bodies, can also be removed easily. Conventional rework equipment, such as hot air tools, can easily damage the component body through excessive and uncontrolled application of heat. Surrounding components are also frequently blown off the board. PCB pad’s are often damaged due to manual removal with hand held tweezers. In contrast, thermal tweezers nozzles will deliver precisely-controlled heat to desolder and remove the component in a single, efficient process.
Thermal tweezers nozzles operate at approximately 200 °C and combine heating action with the ability to physically remove the component from the board. The tweezer blades are attached to the reflow nozzle at manufacture and mechanically bend in during hot air heating at approximately 200 °C, to grip the component to be removed. Once solder is reflowing the component can be lifted up by the tweezer nozzle. Thermal tweezers nozzles are designed for use in combination with the heating nozzle of a rework station such as the OKi APR-5000 Array Package Rework System.
EPP Europe 418
