Thermal management solutions and laminate technology at productronica

Ventec International Group showcased its range of laminate materials at this year’s productronica. Automotive manufacturers around the world, including Ford, Tesla, Audi, and Volkswagen, already rely on the company’s thermal management materials for a range of applications including LED headlights, ECU, break energy reclamation & e-power train.

One such material, which made its European debut at productronica, is the VT5A2 material. It offers high performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 60 Minutes, T288 30 Minutes and T300 15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfils RoHS and WEEE requirements and complies with UL94 V0. This material has been developed for a range of thermally demanding automotive applications.

Other show-highlights included:

Product & material showcase demonstrated PCB material applications in a variety of end-products including a Mercedes Benz C-Class Headlamp (provided by grupo eurocir) featuring an Alu substrate PCB (BiGL) made with VT-4B5 material.
Tec-speed materials has a comprehensive range of products in highspeed/lowloss PCB material technology. Every tec-speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs. Tamara den Daas (Global Account Manager – OEM Technology) presented her paper on Ultra-Low Dk Material for high-speed & low-loss applications. She defined the key issues in high speed PCB’s and backplanes related to trace width and construction, as well as, today’s limitations on the manufacturer to create low loss differential pair traces.
The company’s manufactures its polyimide and thin-core laminates using specially designed treaters with multiple stage filtration systems and 100% Automated Optical Inspection (AOI) for prepreg FOD-control. The VT-901 polyimide material received full qualification by ESA in Amphenol Invotec’s manufacturing process for rigid and flex-rigid PCBs, putting both companies in a market-leading position within the space and aerospace electronics supply chain.
Wider product offering that included flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils, clean room products and coatings, were presented at the show. Backed by its fully owned and controlled global supply chain that ensures product quality, consistency and reliability, the company offers customers a one-stop-shop for their laminates and PCB base material needs.
The company’s App has had a complete facelift giving direct access to all technical updates and news at the touch of a button. With an improved and intuitive user-interface, the app provides up-to-the-minute information on all developments, technical data updates, ongoing projects and news, including the latest data sheets and process guidelines. The app is completely free to download and is compatible with all Apple and Android devices.

www.venteclaminates.com

Other show-highlights included:

Product & material showcase demonstrated PCB material applications in a variety of end-products including a Mercedes Benz C-Class Headlamp (provided by grupo eurocir) featuring an Alu substrate PCB (BiGL) made with VT-4B5 material.
Tec-speed materials has a comprehensive range of products in highspeed/lowloss PCB material technology. Every tec-speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs. Tamara den Daas (Global Account Manager – OEM Technology) presented her paper on Ultra-Low Dk Material for high-speed & low-loss applications. She defined the key issues in high speed PCB’s and backplanes related to trace width and construction, as well as, today’s limitations on the manufacturer to create low loss differential pair traces.
The company’s manufactures its polyimide and thin-core laminates using specially designed treaters with multiple stage filtration systems and 100% Automated Optical Inspection (AOI) for prepreg FOD-control. The VT-901 polyimide material received full qualification by ESA in Amphenol Invotec’s manufacturing process for rigid and flex-rigid PCBs, putting both companies in a market-leading position within the space and aerospace electronics supply chain.
Wider product offering that included flex- & rigid-flex circuit board materials, back-up, entry & routing materials, foils, clean room products and coatings, were presented at the show. Backed by its fully owned and controlled global supply chain that ensures product quality, consistency and reliability, the company offers customers a one-stop-shop for their laminates and PCB base material needs.
The company’s App has had a complete facelift giving direct access to all technical updates and news at the touch of a button. With an improved and intuitive user-interface, the app provides up-to-the-minute information on all developments, technical data updates, ongoing projects and news, including the latest data sheets and process guidelines. The app is completely free to download and is compatible with all Apple and Android devices.