One of our highlights will certainly be the Live Production Line, which will be organised by the Fraunhofer Institute for Reliability and Microintegration, Berlin. With the focus on „PCB for Medical Electronics”, the production line will feature a highly topical subject involving renowned partners from industry and research. In addition to that the SMT/Hybrid/Packaging will once again be demonstrating the full range of products from electronic manufacturing services, design and development, PCB’s, electronic devices, placement technologies to test equipment at the show.
Beside topics for basic knowledge the practice-oriented tutorials of the SMT/Hybrid/Packaging conference (including four in English) will also focus on future-looking subjects, such as new materials, traceability, LED’s and the improvement of manufacturing processes. This year’s conference day will address ”Embedding Technologies and their impact on the value chain of printed circuit boards”; this will be held in German. All three conference days will thus provide an ideal platform for exchanging information about technological advances and discussing issues with experts on-site.
The SMT/Hybrid/Packaging certainly is ”The Place to Be” that shouldn’t be missed offering a unique overview of the whole sector of system integration in microelectronics. Visitors will benefit from a combination of a broad industry representation and the manageable size of the fair. With three halls this is clearly no ‘show exhibition’ but a ‘working’ event.
