“Truly, this is the most exciting thing that’s happened in solder materials development in decades,” says Dr. Mark Currie, Henkel Global Product Manager for Solder Materials. “A material that has temperature stability from shipping all the way through to final assembly is a remarkable achievement.“
In process, Loctite GC 10 offers significant improvements over conventional solder paste materials. As compared to traditional materials which average abandon times ranging from 1 to 4 hours, the halogen-free, lead-free, temperature-stable Henkel formula enables abandon times of up to 24 hours and has a startup time of zero. Stabilized and consistent print transfer efficiency, an expanded reflow window and increased activity for better results with soak temperatures between 150°C and 200°C, make the solder paste incomparable among other paste materials. The solder system’s stability on the line allows for significant cost savings with on-line paste utilization of more than 95%. The reductions in solder-related defects achieved with the solder paste’s process performance result in higher yields and improved profitability.
Not only will manufacturers realize process improvements and cost reductions due to Loctite GC 10’s unmatched performance, but will also experience resolution to long-standing logistics and storage challenges. The temperature stability of the product eliminates the requirement for cold packing, overnight shipping and refrigerated storage. Packaging and shipping costs are reduced and energy consumption within the factory is decreased.
Having been trialed at numerous customers worldwide, the results of the material’s performance indicate future commercial success with widespread integration into electronics manufacturing operations worldwide. “The improved performance, higher yields and better profitability customers will achieve from this breakthrough material are substantial,” explains Currie. “Loctite GC 10 sets a new standard for high-performance solder materials.”
