The system portfolio was expanded considerably in the last three years so that a solution can be offered for every cleaning application in the electronics industry. In addition to the stencil cleaning systems the company offers cleaning systems for cleaning solder frames and condensation traps as well as cleaning systems for PCB assemblies.
“We are looking forward to being at the Benchmark Arena again and ensuring precision cleaned stencils with our type CL 500 cleaning system,” says Ralf Koerner, managing director at Systronic. A program stored in the system’s PLC control is started depending on the products to be cleaned in the process. The cleaning agent is applied to the stencils or PCB assemblies from the storage tank by rotating spray arms. Cleaning takes place in a cyclic process. Cleaning is followed by the so-called drip time to guarantee ideal flow back of the cleaning agent into the storage tank. The products to be cleaned are transported through the rinsing chamber into the drying chamber by an automatic chain conveyor. The stencils/PCB assemblies are fed between two fixed nozzle banks during transport through the rinsing chamber. The cleaning agent and any adhering residue particles are rinsed off. The substrate is dried as quickly as possible by hot circulating air which is conveyed by a cross current fan.
As described, the cleaning system has separate chambers for cleaning, rinsing and drying. This 3-chamber system ensures that only the cleaning agent on the product being cleaned (stencil or PCB) is dragged from the cleaning chamber into the rinsing. The cleaning agent still on the chamber walls as well as in pipes and pumps stays in the cleaning chamber and is not rinsed off. The 3-chamber process therefore ensures optimum separation of cleaning and rinsing medium. In comparison with cleaning systems with only one process chamber, the cleaning medium consumption in the 3-chamber system therefore tends to be lower.
In addition to the lower cleaner consumption, the rinsing water preparation is also less expensive due to the less drag. The lower costs can be expected with the 3-chamber process on the whole.
As already mentioned, drying takes place in another, separate chamber. Two stencils can therefore be cleaned simultaneously in the system and high throughputs achieved as a result. The separation of the cleaning and drying chambers also prevents drying of the chamber walls. Only the cleaned product is dried which contributes additionally to the low consumption.
SMT, booth 7-431, 7-639
EPP Europe 403
