The reviews are in, and the IPC Apex Expo 2023 was, for many, “the best show in years”. This was not only down to the number of visitors – 6,901 participants in total across the three days – but to the event’s laser-sharp focus on the future of the industry. This year’s theme ‘Advance in a New Era’ was no more pertinent that at the well-attended technical conference which comprised five tracks, 28 sessions and 104 peer-reviewed papers, presenting research from industry experts from 18 different countries. “From attendees, I was pleased to hear accolades on technical program offerings, many stating that it was the best conference in years – attendance was at an all-time high in more than a decade,” IPC President and CEO John W. Mitchell said.
Advanced packaging is the new king
Conference highlights included a jam-packed special session on advanced packaging led by IPC’s Chief Technical Officer Matt Kelly. In his opening comments, Kelly quoted Todd Younkin President & CEO Semiconductor Research Corporation, who said during IPC’s first Advanced Packaging Symposium in October 2022, that “packaging is the new king”.
Citing a recent IPC survey, Kelly underlined that the electronics manufacturing industry is well-aware that improving semiconductor performance is increasingly reliant on advanced packaging and yet, the USA and Europe are lagging well behind Asia when it comes to IC substrate – build-up substrate, and 300mm bumping specifically – and package assembly capability and capacity.
Kelly urged both governments and the industry to take a holistic view of the situation, focusing not only on chips or ‘silicon’ but to the development of an advanced packaging ecosystem. This he termed a ‘silicon to systems’ approach. As E. Jan Vardaman, President and Founder of TechSearch International said in her presentation following Kelly’s: “You can make all the silicon chips you want, but if you can’t package them they don’t do you much good … what is the point of making the chips here if you just send them overseas for assembly?”
Among other things, Kelly said the addition of robust advanced packaging language into EU Chips legislation would be necessary, and emphasised that sustainable, regional advanced packaging ecosystems in North America and Europe, required “Governments, Commercial Industry, and Academia to continue collaborating, developing, and executing”.
E-mobility & EVs
Another special session focusing on the market trends and challenges in PCBA manufacturing for the e-mobility industry was led by Brian O’Leary, Global Head e-Mobility & Infrastructure at Indium Corporation and Jason Schwartz, Business Development Manager at KYZEN.
How to improve the reliability and performance of electronics both in EVs themselves and in chargers was central to discussions. The incidence of electronic failures is almost 40% higher among EVs a subset than those experienced by the automotive sector as a whole – partly because of EVs have up to three times more electronics and because PCB assemblies in EVs are having to work harder, longer and at higher operating temperatures (requiring longer mission profiles and higher voltage). Similarly, with EV chargers not meeting consumer needs, a long-lasting, fast-charging infrastructure needs to be developed in which devices can be protected from both high heat and unpredictable weather. Speakers called for the development of industry standards in both areas.
Automation and robotics
It was clear on the showroom floor that the integration of robotics and automation technology into electronics manufacturing has become so ubiquitous that no longer warrants the word ‘trend’. Demand for, and interest in automation technology was at an all-time high and visitors were not disappointed by the offerings on show – everything from automated component supply systems to automated rework systems – the majority of which can now be seamlessly integrated into existing manufacturing processes. AI and factory of the future software solutions were also very much in the spotlight.
Response to the show
IPC says its survey responses about the show were overwhelmingly positive. “IPC APEX 2023 was a big hit for us – the best show in years! Our booth was consistently packed with every demo station in use by customers,” said Davina McDonnell, global marketing manager, Cogiscan.
“I applaud the association on its continued drive to improve, enhance, and spotlight things that matter to our industry. Insulectro had a super experience as well – our best exhibiting experience ever,” said John Lee, vice president of marketing and brand strategy, Insulectro.
“IPC Apex Expo is a gathering place for the present and future of electronics, enabling all of us to connect in remarkable ways,” Mitchell said. “We at IPC are profoundly grateful to an industry that has encouraged and supported us in producing [the event]. We never lose sight of the fact that we could not host this event without the dedicated volunteers who share their time, their expertise, and their enthusiasm with all of us.”
IPC Expo 2024 will take place from 6–11 April 2024, in Anaheim, California.
