- In-circuit test, which remains the most cost-effective means to identify assembly and component defects. Digital devices will likely feature boundary scan.
- Reduction of process complexity and inventory cost by programming in-system programmable devices “on-board” after they are attached physically to the module.
- Functional test will require bus interface and communication tests and application or simulation of the physical attribute the sensor module is designed to measure.
- Achieving faster throughput and therefore increased capacity by reducing time and process complexity at test and device programming.
