Alpha Assembly Solutions, a producer of electronic soldering and bonding materials, addresses the issue of voiding with its latest selection of product technologies. Voiding is a common issue in PCB Assembly and caused by volatile ingredients in the solder paste. It can occur anywhere in the solder joint and is especially problematic as it reduces the mechanical properties and thermal conductivity of solder joints.
To solve this issue, the company has developed the AccuFlux technology for preforms. The flux coating when applied to a preform is engineered to decrease voiding for power components that require consistent low-voiding solder joints from normal SMT processes.
“AccuFlux technology allows a specially designed coating with an ultra-low voiding flux formulation to be applied accurately from preform to preform,” explains Mike Marczi, Vice President of Engineered Materials at the company. “This precise flux deposit ensures a repeatable void performance. Preforms coated with it also deliver excellent electrical reliability and maximized component heat dissipation.”
In addition, the company’s TrueHeight spacers are available for void reduction under LGA components. “These spacers can be strategically placed under LGA or any larger size leadless components to provide an exit path for outgassing,” said Jerry Sidone, Product Manager for Engineered Materials. “Their low profile and small size make them an ideal solution for void reduction and reducing component tilt.”
