Commenting on the decision to change, Gábor Szabó, Technical Director said: “We were very impressed with the rigidity of the stencil foil, the simplicity of the design and the ease of use of Alpha TetraBond, this, coupled with the Alpha teams knowledge on stencil design rules, made the decision to change a fairly straight forward one.”
Gary Cunning, Global Business Manager at Alpha commented: “Samsung are the latest in a long line of major PCB assemblers to make the switch to Alpha TetraBond. Since its launch in September 2010, we’ve already surpassed our own expectations of the speed with which this pro- duct has had an impact on the market. We are delighted to strengthen our partnership with Samsung with this offering.” The technology is the culmination of frameless stencil development; an elegantly simple system de- signed to enhance the rigidity of the stencil foil, making safe mounting and demounting an easier proposition.
Innovatively encompassed in a thin, one piece aluminum extrusion, the stencil foils are designed for use with Tetra foil tensioning frames and are backward compatible with the majority of frames currently in the market, including VectorGuard. They are available with all Alpha Stencil technologies to suit the majority of printer size requirements.
